1) The base Material: FR-4 / Flexible board,
Other material: FR-5/ Tg170/ Polyclad / Rogers / Teflon/ Aluminium Base material
2) Max Copper Thickness: 6OZ (210um)
3) Finished Board Thickness: 0.15mm ~ 7.5mm
4) Layers: 2 Layers ~ 50 Layers
5) Max Production Panel Size (L*W): 1092 mmX 762 mm (43X30 sq inch)
6) Minimum Internal Layer Line/space: 3mils/3mils
7) Minimum Laser Blind Via Hole size: 0.10mm (4mils)
8) Max Aspect Ratios: 15: 1 (hole size: 0.25mm)
9) Min. Solder Mask Bridge: 0.050mm(2mils)
10) SMT Pitch: 0.25mm (10mils)
11) Impedance Control: +/- 5%
12) Surface Processing: HAL, Lead-free-Hal, Flash Gold, Thick Gold, Immersion Gold/Silver/Tin, Gold Finger plating, Pre-flux(Entek), OSP, Seletive ENIG
13) Solder Mask Types: Liquid Photo-Imageable(W/F), Conventional S/M, UV S/M
14) Profile: CNC Routing, Punching, V-Cut
15) Special-Tech: Blind and buried via \ Backplane \ HDI: 1+N+1, 2+N+2 \Impendance control Back Drilling\ Bury Resistor \ Bury Capacitor \ Mix Pressing \ Step Slot&Step Boards